In-circuit digital tester

ABSTRACT

An apparatus for the automatic, in-circuit testing of the electrical properties of complex digital integrated circuit assemblies is disclosed. A programmed processor is provided to control a set of selectable switches, which connect selected nodes of a circuit under test to certain ones of a plurality of signal lines. One of the signal lines supplies a selected digital test signal from a set of selectable test signals to the selected node. The set of test signals including a Gray code. Another of the signal lines provides a response line connecting a selected node to a functional tester that performs one of a selectable number of intermediate functional tests. One of the functional tests is a signature analysis of the digital response signal in accordance with a cyclic redundancy check (CRC) coding technique. Each test performed by the apparatus is specified through processor routines which select and encode the proper test signals for the particular circuit or device under test and analyze the results of the intermediate functional tests to determine if the device has functioned properly.

BACKGROUND OF THE INVENTION

The present invention relates to a measuring and testing apparatus fortesting complex digital circuits; more particularly, to automaticdigital in-circuit testers for testing digital circuits containing, butnot limited to, large scale integrated circuits.

The in-circuit tester of the type disclosed herein is a tester that iscapable of testing a circuit without regard to whether or not theelectrical node into which a test signal is injected is connected to theoutput of another logic device. The disclosed in-circuit tester iscapable of generating and applying a digital test signal to an outputnode of a logic device that is normally at a logic ground, and causethat output to go to a logic high without damaging the device. In otherwords, the use of the term "in-circuit" means that the device or circuitunder test does not have to be isolated or removed from the surroundingcircuits in order to apply test signals and to monitor its output.

Printed circuit boards containing complex digital integrated logiccircuits interconnected by copper lands to form functional circuits,offer a greater challenge to prior-art in-circuit digital testers thanthey are able to meet. Prior art testers are able to selectinterconnection points between the digital components, referred to asthe electrical nodes, and to apply test signals to a circuit or tomonitor the response of the circuit to those signals. However,ever-increasing complex logic devices, such as micro-processors, arebeing developed and extensively used by today's circuit designers.Prior-art digital in-circuit testers are not capable of performing thenumerous, rapid and varied tests required for such complex circuits.

One of the most significant developments in digital circuit technologyin recent years has been the fabrication of large and complex digitalcircuits on a single chip of semiconductor material using large scaleintegration (LSI) techniques. These circuits typically contain a greatnumber of transistors and other components which enable the designer topackage a greater number of circuits in a relatively small volume.Research and development is underway in the form of very large scaleintegration (VLSI) for methods to manufacture an even greater number ofcircuits within a single chip. Where LSI has thousands of transistorsper chip, VLSI has hundreds of thousands. As a result of the largenumber of circuits contained in LSI devices and the expected increasesin circuit complexity from VLSI technology, the probability of chipfailure has increased. Correspondingly, the importance of testing anddiagnosis of chip failures has also increased. However, the prior-artdigital in-circuit testers either are not capable of performing thecomplex tests required, or are too slow, due to the time required togenerate all the necessary test signals to test these complex circuits.

Because of the increased packing density of digital circuits and thewide variety of logic functions available, LSI devices are enjoyingwidespread use in most digital circuits and systems which designers arepresently producing. The reliability of such systems and circuits dependgreatly on the reliability and accuracy of operation of the LSI devicesand, thus, a need has arisen for new and sophisticated equipment andprocedures for testing of these circuits. Such testing is relativelydifficult because of the great number of different functional sectionsin each device. The problem is further compounded by the limited numberof test nodes available to each integrated circuit for the connection ofinput and output signals.

Most of the functional sections of the integrated circuits consist ofeither combinational logic circuits or sequential logic circuits or somecombination thereof. A combinational logic circuit is defined as onethat consists entirely of gates (AND, OR, etc.). In a combinationallogic system, no clock is required, and after the inputs have beenestablished (disregarding settling time), the output is immediatelyavailable for checking to determine whether it conforms to the outputsignal that the circuit should correctly produce in response to thespecified input signal. On the other hand, sequential circuits require asequence of changes in the input test signals, such as a clock, beforean output signal, produced in response to the test signals, can beexamined to determine if the device correctly responded. Because of thecomplexity of the digital circuits and the fact that there exists only alimited access to the integrated circuit chip's circuits via the ICpins, many different test signals must be generated before all of thefunctional capabilities of the LSI device can be checked. In a greatmany instances, an output signal must be checked as to the pattern ofone's and zero's that is produced in response to a known set of inputtest signals to determine if the chip is working properly.

It is thus apparent that an apparatus for testing circuit assembliescontaining LSI circuits must be able to develop and analyze a largequantity of data and test signals. Further, the test apparatus must beadapted to perform tests on a large number of different LSI circuitshaving widely different transfer functions. To best accomplish thisrequirement, a computer controlled test system is preferred. Theversatility of test programs both to generate the necessary test signalsand to analyze the resulting response signals make the computer anecessary element of a test system for digital circuits having LSIdevices. Although the computer offers great flexibility in selectingtests to be performed, often the response signal produced by thegenerated test signals consists of bit streams of data that wouldrequire excessive computer storage and execution time to analyze eachand every bit so produced. Therefore, a technique of compressing the bitstream down into something that can readily be assimilated by thecomputer to obtain maximum usage of the computer's capabilities would bedesirable. This compression of the long bit streams can be accomplishedby using a cyclic redundancy check (CRC) coding technique, whichlogically combines each bit with those that went before, to generate acompact digital code or signature. This signature represents, almostuniquely, the length and pattern of one's and zero's that occured. Thecomputer could then compare the measured code against a code for acorrect response, to determine if the device is functioning properly.

A limitation of known computer-aided testers is the fact that thecomputer remains operatively tied into the test circuit during theperformance of the test, because it is used as a source of test data.Because many LSI devices require lengthy and complex test signals inorder to properly simmulate normal operations of the device, and becauseof speed limitations imposed by software-generated test signals, thesetypes of computer-aided systems are capable of performing only a limitednumber of tests on these devices within a given time interval. However,if a computer-aided tester were provided which used intermediate testcircuits to generate the test signals and to perform the functionaltests, leaving for the computer only the initialization of the testercircuits prior to the test and the analysis of the results following thetest, the power and flexibility of the computer could effectively beutilized.

Thus, it would be advantageous to provide a computer-controlledin-circuit digital tester for testing digital circuits employing thecomplex integrated circuits resulting from LSI technology in whichappropriate test signals are generated and functional tests performed byintermediate test circuits, the results of which are analyzed by thecomputer.

SUMMARY OF THE INVENTION

In accordance with this invention, an automatic, computer-controlleddigital in-circuit tester is provided for controlling a test cycle inwhich digital test signals are generated for a circuit under test. Aresponse signal generated from that circuit in response to the testsignals is checked for a proper response. A set of selectable electricalnode test pins are provided, to contact the circuit interconnections ofthe circuit test. These test pins permit the application of the testsignals at selected points of the circuit and the monitoring of aresponse to those signals. The test signals are applied to the circuitunder test through a set of selectable test signal switches associatedwith each of the test pins. Through processor control, a selected testpin has one switch from its associated set of test switches selected, toeither apply a test signal to the test pin or to connect the test pin toa response signal bus. A digital test-signal generator is provided foreach set of test switches to generate one signal from a set ofselectable digital test signals. Among the set of digital test signalsare signals which have the characteristic that identifies them as a Graycode.

A test controller, responsive to the processor, is provided forcontrolling the generation of a test cycle in which the digital testsignals are generated. The response signal generated during the testcycle is monitored by a functional tester to perform intermediateprocessor selected tests. One of the functional tests is thedetermination of the signature of the response signal by generation of acyclic redundancy check code. The result of the functional tests isinputted to the processor, where it is compared to the expected responseto determine if the circuit under test has functioned properly.

BRIEF DESCRIPTION OF THE DRAWINGS

For a fuller understanding of the nature and objects of the invention,reference should be had to the following detailed description taken inconnection with the accompanying drawings, in which:

FIG. 1 is a block diagram of the computer-controlled digital circuittester;

FIG. 2 is a block diagram of the test signal generator;

FIG. 3 is the timing diagram for the set of selectable Gray code digitaltest signals;

FIG. 4 is the circuit diagram of the pin memory data transfercontroller;

FIG. 5 is a circuit diagram of the test signal address generator and theD & E sync generator;

FIG. 6 is the circuit diagram of a test signal D switch driver;

FIGS. 7(a) and 7(b) are block diagrams of the test controller, the D, E,F & G switch selector and the functional tester;

FIG. 8 is a circuit diagram of the listen enable and start-of-test cyclegenerators;

FIG. 9 is a circuit diagram of the functional tester; and

FIG. 10 is a timing diagram which illustrates the generation of a listenenable signal.

Similar reference characters refer to similar parts throughout theseveral views of the drawings.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

It will be helpful in understanding the following discussion to definecertain logic terms. Each of the logic signals to which reference ismade in the following discussions will have one of two possible logicstates, a logic 1 or a logic 0. A logic signal will be designated as atrue signal without an asteric following the mnenomic. As an example,CLOCK would be a true signal while CLOCK* would be its inverse. Eachlogic signal, be it the true signal or its inverse, will have anasserted and unasserted state. In the case of CLOCK, a true signal, theasserted state will be a logic 1 and the unasserted state a logic 0. ForCLOCK*, the reverse is true, the asserted state is logic 0 and theunasserted state is logic 1. A signal goes "true" when it switches fromthe unasserted to the asserted state and vice versa when it goes"false." Lastly, a flip-flop is in a logic 0 state when the Q output isat a logic 0 and the Q* is a logic 1. In the logic 1 state the outputsof the flip-flop are in the reverse states.

Referring first to FIG. 1, a block diagram of the computer controlleddigital in-circuit tester is shown, with a central processing unit (CPU)100 having a set of input/output (I/O) ports 102 that are used tocommunicate between the CPU 100 and the remaining circuits of thedigital tester. I/O ports 102 contain standard interface circuits forinterfacing the CPU 100 to a peripheral device. As used herein, the term"central processing unit" is meant to include all programmable orprogrammed devices of any size, such as microprocessors, minicomputers,computers, time-share computers, main frame computers, batch processors,data processors, etc.

The digital tester 101, which responds to commands from the CPU 100, iscomposed of test controller 104, test signal generator 108, functionaltest 106, board select decoder 114, D, E, F & G switch selectors 116,reed switches 120 and a bed of nails 122. The bed of nails 122 consistsof an array of selectable test pins that are contactable with thecircuit interconnection nodes of the logic circuits on the printedcircuit board of device under test (DUT) 124. The DUT 124 is a printedcircuit board assembly in which the interconnections between the variouscomponents are for the most part made with copper lands. Each DUT 124will have its own preselected array of test pins that form the bed ofnails 122 which contacts the interconnection points or electrical nodesof the circuits on the DUT. The test pins that will be used in testingthe DUT 124 in each test cycle is selected from the bed of nails 122 andprogrammed into the processor. The DUT 124 is placed over the bed ofnails 122 and a vacuum to cause the DUT PC board assembly to move downand contact the test pins in the bed of nails 122. The board is causedto move a sufficient amount to cause the spring loaded test pins tocompress. This ensures that the test pins are contacting theinterconnection nodes of the DUT 124 with sufficient force to penetratethe copper land.

Each pin in the bed of nails 122 has an associated set of selectableswitches, designated as the D, E, F & G switches, connected to it. Itshould be noted here that the D, E and G switches are provided as asafety feature to protect the digital tester 101 internal circuits fromexcessive logic voltages that may appear on the electrical nodes of theDUT 124 by isolating each test pin through these switches.

For the digital tester 101 to work, the D, E and G switches do not haveto be provided. However, the F switch is provided so that the test pinwhich will contact the output test signal node can be connected to theresponse line 128. Therefore, the set of selectable switches associatedwith each test pin could be as few as one but as many as desired. Asshown in FIG. 1, one terminal of each of these selectable switches isconnected to the test pin. During each test cycle, each of the selectedtest pins that contact the DUT 124 can either conduct an input testsignal to the DUT or can conduct the selected output signal for the DUT,or it can alternately do both. If the selected test pin is to input aninput test signal, the switch will be selected. The terminals of the Eand G switches for each of the test pins that is not connected to itsassociated test pin are bussed together, respectively. The E switchselects the EXT CLOCK signal from the DUT to be applied to the masterckock generator 706 (see FIG. 7(a). The F switch selects the node of theDUT that is to be the response signal and applies it to the functionaltester 106 (see FIG. 7(a). Each test pin in the bed of nails 122 has thecapability of applying a preselected digital test signal to DUT 124through its D switch when the switch is selected. Each test pin has anassociated digital test signal generator whose output can be connectedto the test pin through a D switch.

If the test pin is to be connected to the electrical node that is theoutput signal for the circuit under test, switch F is selected. The Fswitches for each of the test pins in the bed of nails 122 are alsobused together to form the response signal line 128. Response signalline 128 is inputted to the functional tester 106, where one of fourfunctional tests is performed. Because of the large number of test pinsavailable in the bed of nails 122 (for the preferred embodiment 1,024pins), practical considerations of constructing the tester require thatthe test pins be grouped into smaller subsets on boards to accommodatethe circuits required to contain the D, E, F & G switches, to select theappropriate ones of those switches for each test pin used in the test,and to generate the digital test signals for the test. These circuitsare chosen for inclusion in the subsets because they are duplicated foreach test pin in the bed of nails 122.

For the preferred embodiment, the bed of nails 122 is divided intogroups of sixteen test pins. Within each group, the E, F and G switchesare bussed together. Further, the bussed E, F and G selectable switchesare connected to buses between the groups of sixteen test pins throughselectable switches KFD, KED, and KGD. These selectable switches, KFC,KED and KGD, provide isolation for the internal bussing of the sixteentest pins from the external bussing between the groups of switches. But,in any event, each E, F and G switch for each test pin is connectable tothe same bus.

The circuits required to generate sixteen separate digital test signalsfor each of the sixteen test pins in the subset, to select which of thefour selectable switches for each test pin that is to be used during thetest cycle, and to contain the actual reed switches and their coildrivers to provide the D, E, F and G contacts, are mounted on a singlePC board assembly. Thus, for the preferred embodiment, a total of 64boards are required for a bed of nails of 1,024 test pins. As shown inFIG. 1, each PC board assembly 103 containing the above describedcircuits is composed of a pin memory 112, test signal drivers 118, aboard select decoder 114, D, E, F & G switch selectors 116, and reedswitches 120.

Still referring to FIG. 1, the digital tester is used as follows: Acircuit diagram of the device to be tested is examined to identify thecircuits or chips that are to be tested. In general, all nodes will becontacted by a test pin, even unused elements of the integratedcircuits. The electrical nodes that are to be used in a test cycle aseither an input node or as the circuit under test response node areidentified and assigned the number that corresponds to the test pinnumber that will contact that node when the board assembly is placed onthe bed of nails. Knowing how the circuit under test is intended towork, computer routines are generated that will, when executed by thecomputer, cause the tester to generate appropriate test signals to theelectrical nodes of the circuit under test. The tester 101 circuits willmonitor the response signal and perform intermediate tests on thesignal. Under computer control, the tester 101 will transmit the resultsof the intermediate tests to the computer, where a comparison betweenthe measured response and the expected response determines if thecircuit has functioned properly.

Each integrated circuit in the circuit under test is tested during atest cycle defined to be that period during which the digital testsignals are actually being applied to the circuit under test. Althoughall of the test parameters are specified by computer software, theactual tests are carried out, for the most part, independently ofcontrol of the computer. That is, the computer specifies the type oftest that is to be performed, the length of the test cycle, the types oftest signals that are to be generated, the test pins to be selected,etc., prior to initiation of the test cycle. Once the test cycle isinitiated, the CPU 100 must wait until the test cycle is finished beforeit acquires the results of the intermediate tests. As a result, the CPUsupplies the digital tester 101 with the initial conditions for the testto be performed, before it causes the test cycle to begin.

The CPU 100, acting through I/O ports 102, initialize the circuits oftester 101 prior to a test cycle, by sequentially addressing each testpin that is to be used in testing of the circuit under test, and selectsand latches at least one of the D, E, F or G switches for each of thoseselected test pins. Where appropriate, the KFD, KED and KGD switches arealso selected and latched. Having selected and closed a switch for eachtest pin that will apply a test signal to an input node of the circuitunder test, and having selected and closed the F switch of the test pinthat will be the response signal, the CPU 100 next sequentiallytransfers to the pin memories 112 the data necessary for the digitaltest signal generators to generate the appropriate selected test signalfor the selected nodes of the circuit under test. Pin memory address anddata load generator 110, in response to commands and data from the cPU100, stores digital data in pin memory 112. This data, when read duringthe test cycle, generates a pattern of one's and zero's on the input oftest signal drivers 118. In response to the pattern, the drivers 118generate the digital test signals that are applied to the selected testpins through their closed D switches.

To complete the initialization of the tester 101, the CPU 100 strobesinto test controller 104 the parameters which specify: (1) Whether aninternal or an external clock reference signal is to be used to generatethe digital tester 101 system clock; (2) data which determines thefrequency of the system clock derived from the selected reference clock;(3) which of the intermediate tests is to be performed on the responsesignal; (4) the length of the test cycle that is to be performed; (5)the time during the test cycle in which the response is tested and timeduring which the response is ignored; and (6) data to generate athreshold voltage which enables the digital circuit tester to interfaceto a wide range of logic voltage levels from different DUT's.

Having initialized the circuits of tester 101, the CPU 100 may nowinitiate a test cycle by issuing the appropriate command to the testcontroller 104. At the completion of the test cycle, the CPU 100transmits a command to the tester 101 to transfer the contents of thefunctional tester to the computer. A comparison is then made between theactual result that would have been produced from a properly functioningcircuit, to determine if the circuit is working. The precedingdiscussion has been given to explain how the tester is used, so that thefollowing detailed description of the circuits which implement theabove-described functions may more readily be understood.

Shown in FIG. 7(b) are board select decoder 114, D, E, F & G switchselectors 116 and reed switches 120, which function to select and closeone or more of the four selectable reed switches for the test pins usedduring the test cycle. Board select decoder 114 and D, E, F & G switchselectors 116 function as the switch-selecting means for selecting whichreed switch is to be closed during the test cycle. A 8-input NAND gate728 decodes the board address signals, BA0 through BA6 and theirinverse, to generate the board select signal BS if this board isselected.

Each slot of the digital tester into which a board is to be plugged hasa unique address assigned to it. As previously discussed, each boardcontains the circuits for sixteen test pins. This board address isencoded into the connector wiring for the slot, such that theappropriate board address signal (BA0 through BA6 or its inverse) isapplied as one input to NAND gate 728. The output of NAND gate 728 isOR'ed in NOR gate 730 with a board address override signal (BAOR)* togenerate the signal BS. The signal BAOR* is generated when a boardselect signal is to be generated on all of the boards simultaneously.The board address signals are generated by the test controller 104 inresponse to commands and data from CPU 100. CPU 100 also generates reedaddresses (RA0 through RA3) and reed group addresses (RG0* and RG1*)which D, E, F and G switch selectors 116 decode, to select, for each ofthe sixteen test pins on the addressed board, one of the four selectableswitches.

Reed addresses RA0 through RA3 and reed group addresses RG0* and RG1*are inputted to D, E, F and G switch selectors 116 to address aplurality of latches, to both store and reset the selection of theselectable switches. The RG0* and RG1* signals are decoded to select oneof the four selectable switches (D, E, F or G), and the address signalsRA0 through RA3 are decoded to select one of the sixteen test pins on aboard. Since the selection process for the D, E, F & G reed switches isthe same, only an explanation for the selection of the D switches willbe given.

Still referring to FIG. 7(b), in the clearing process for the D reedlatches 732 and 734, a BS signal, when true, enables clear reed switchdecoder 738, so that the reed group addresses, on the occurrence ofRCLR* from CPU 100, generate one of four possible reed switch clearsignals: CD*, CE*, CF*, or CG*. For clearing of the D reed latches 732and 734, the signal CD* is generated. This signal is applied to theclear input of the latches 732 and 734 to clear any latches that wereset from the previous test cycle.

In the reed switch selection process, reed addresses RA0 through RA2provide a three bit octal address for latches 732 and 734. Reed addressRA3, in conjunction with the reed group signals RG0 and RG1, are decodedby set reed switch decoder 736, on the occurrence of R STROBE*, togenerate four pairs of enabling signals, ED0* and ED1* through EG0* andEG1*, with each pair selecting the pair of reed latches for each of thefour selectable switches for each test pin. In other words, for the Dswitches, enabling signals ED0* and ED1* are generated to enable reedlatches 732 and 734, respectively. With the set/clear* (S/C*) signal ata logic one, the individual latch addressed by the reed addresses RA0through RA2, in conjunction with the enable signal from set reed switchdecoder 736, loads a selection command into the addressed latch. Theoutputs from D reed latches 732 and 734 are applied to relay drivers 742to energize the selected D reed switch. In this manner, each of theselectable switches associated with each of the test pins may beselected and latched closed prior to the start of the test cycle.

Again referring to FIG. 1, test signal generator 108 is shown, composedof pin memory address and data load generator 110, pin memory 112 andtest signal drivers 118. Identical pin memory 112 and test signal driver118 circuits are contained on each of the tester boards in the digitaltester 101. The output from pin memory address and data load generator110 is bussed to each of the pin memory 112 and test signal drivers 118contained on each of the system tester boards. Pin memory 112 respondsto the board select signal BS to enable the data on the bus from pinmemory address and data load generator 110 to be inputted to theselected board. In this way, the circuits for pin memory address anddata load generator 110 do not have to be duplicated for each board inthe tester in order to generate a digital test signal for each test pin.The function of the test signal generator 108 is to generate, during thetest cycle, one of the digital test signals from the set of selectabletest signals that includes the Gray code set of signals. Since theoperations of pin memory address and data load generator 110, pin memory112 and test signal drivers 118 are identical for each of the testerboards, only a discussion of one will be given.

Referring now to FIG. 2(a) and 2(b), which illustrates a typical testsignal generator 108, pin memory address and data load generator 110 isshown, composed of pin memory data transfer controller 200 test signaladdress generator 202, D and E sync generator 204, and pin memoryaddress multiplexer 206. The function of the pin memory address and dataload generator 110 is to generate memory addresses and memory data forpin memory 112. Pin memory addresses are generated at two differenttimes. First, prior to a test cycle, data must be transferred and storedin pin memory 112 that will generate the digital test signal to beapplied through the selected D switches for each of the selected testpins to the circuit under test. Second, during the test cycle, addressesmust be generated to pin memory 112 to read the contents of the memoryto generate the desired test signal.

The pin memory address and data input signals which program the pinmemories 112 prior to a test cycle are generated by the pin memory datatransfer controller 200. Pin memory data transfer controller 200,responding to inputs from CPU 100, generates an 8-bit data word onmemory data lines MD0 through MD7. These data lines are inputted to pinmemory 112 where tristate buffers 210, enabled by the BS signal for thisboard, pass the data to the input of the memories 214. At the same time,pin memory data transfer controller 200 generates a set of data transfermemory addresses, DTMA0 through DTMA3, which are inputted to pin memoryaddress multiplexer 206. Additionally, pin memory data transfercontroller 200 generates two control signals, write enable MW* and datatransfer memory address mux, DTMA MUX. The signal DTMA MUX is inputtedto pin memory address multiplexer 206 to cause the data transfer memoryaddress lines to be multiplexed onto the memory address lines MA0*through MA3*, which form the input address lines for the memories 214.The control signal MW* is inputted to the pin memory write enabledecoder 208, to enable a write cycle to the memories 214. Also inputtedto pin memory write enable decoder 208 are the memory group addressesMG0* and MG1*. The two addresses are inputted directly to decoder 208from the CPU 100 through I/O ports 102 to generate WE0* through WE3* inthe pin memory write enable decoder 208.

Each of the memories 214 is able to generate digital test signals fortwo of the D selectable switches. Thus, for a total of sixteenselectable D switches per board, 8 memories are required. The devicesthat are used in the preferred embodiment of the invention for the pinmemories are 16×4 bit random access memories such as a 74LS189manufactured by National Semiconductor, Inc. It will be appreciated bythose of ordinary skill in the art that memory devices of differentstorage capacity could be substituted for the memories used in thepreferred embodiment, such as four 16×1 memory chips. Therefore, eachpin memory requires four bits of data input and four bits of addressinput to address and store data in each of the addressable memorylocations.

Since the data lines from pin memory data transfer controller 200 total8, two memories or two test signal generators are programmed at the sametime. Therefore, by bussing a write enable signal to two consecutive pinmemories, only four pin memory write enable signals need be generated.The function of pin memory write enable decoder 208 is to generate thosefour write enable signals. The memory group address lines MG0 and MG1specify which of the four groups of two-pin memory chips are to beenabled, and when MW* is true, decoder 208 generates one of the four pinmemory enable signals WE0* through WE3* specified by MG0 and MG1.

Test signal address generator 202, responding to a START CYCLE* fromtest controller 104, generates the Gray code memory address lines, GMA0through GMA3, which are also inputted to pin memory address multiplexer206. These address signals are generated during a test cycle to addressand output the contents of the memories 214, to generate the test signalwhich the D selectable switches will apply to the circuit under test.The Gray code memory addresses are multiplexed on to the memory addresslines MA0* through MA3* by pin memory address multiplexer 206, when thesystem DCLR* signal and the control signal from pin memory data transfercontroller 200, DTMA MUX, are both unasserted. A third mode ofaddressing the pin memories is also possible. This occurs when both thecontrol signal DTMA MUX and DCLR* are at a logic 0. For this condition,CPU 100 delivers the memory address lines directly from one of the I/Oports 102 to pin memory address multiplexer 206. That address thenappears on the memory address lines MA0* through MA3*.

When a test cycle begins and Gray code memory addresses are generated bytest signal address generator 202, D sync and E sync generator 204, inresponse to these addresses, generates the synchronization signalsDSYNC* and ESYNC*. These two synchronization signals are used by thetest signal drivers 118 in the generation of the digital test signalsthat are applied to the DUT via the D selectable switches.

Referring now to FIG. 4, which shows the circuit diagram for pin memorydata transfer controller 200, system commands CMD2* and CMD3*, generatedin test controller 104, are used to select one of two operating modes fothe controller 200. In the first mode, data transfer controller 200 canpass the 8-bits presented by CPU 100 via I/O ports 102 to the memorydata lines MD0 through MD7; or, in the second mode, controller 200 mayaccumulate sixteen consecutive 8 bit data values from the CPU beforethat data is placed on the memory data lines. To operate in the firstmode, system command CMD14* is asserted. This signal is inputted togenerate MW* which, as previously discussed, enables pin memory writeenable decoder 208 (see FIGS. 2(a) and 2(b) to write the 8 bits into thememories 214. With the assertion of CMD14*, the data that is presentedby CPU 100 to the "A" inputs of multiplexer 424 is muxed onto the memorydata lines and strobed into the pin memories 214 enabled by one of thefour write enable signals, WEO* through WE3*, generated on the output ofpin memory write enable decoder 208.

For the first mode of operation, the output of pin memory addressmultiplexer 206, MA0* through MA3*, is derived from an address specifiedby CPU 100 on the data lines of one of the output ports of I/O ports102. The signal DTMA MUX is not asserted in this mode, but the signalDCLR* is. Therefore, pin memory address multiplexer 206 is selecting thedata lines from one of the I/O ports 102 output ports to generate thememory address lines. For each 8 bit data word that is to be strobedinto the pin memories, a CMD140 signal is asserted.

For the second mode of operation of data transfer controller 200, inwhich sixteen consecutive 8 bit data words will be stored beforetransferring to the memories 214, two steps must occur. First, each 8bit data word must be strobed into an 8 bit shift register 400, andsecond, the contents of shift register 400 must be transferred into 16×8bit shift register 422, which is acting as the buffer storage device.When shift register 422 is full, system command CMD2* is asserted toinitiate the sequence of transferring the contents of shift register 422through multiplexer 424 onto the memory data lines. For each 8-bit dataword that is supplied from I/O ports 102 output port number 3 to theinput of shift register 400, PORT 3 STROBE* is asserted to strobe the8-bit data word into the shift register 400. At the same time, PORT 3STROBE* resets set-reset flip-flop 402 to a logic zero. The Q outputfrom flip-flop 402 is inputted to NOR gate 404, whose output switches toa logic zero and removes a clear signal to cascaded binary counters 410and 412. Removing the clear signal to these two counters enables them tobegin counting a 2 MHZ internal clock generated by test controller 104.The Q_(C) and Q_(D) outputs from counter 410 and the Q_(A) output fromcounter 412 are decoded in OR gates 416 and 418 to provide an enablingsignal when any one of these three signals is true. This enable signalis inputted as one input to AND gate 420. The other input of AND gate420 is the Q_(B) of counter 410, which is the highest frequency signalon the Q outputs of counters 410 and 412 that are used by controllers200. As a result, the output of gate 420 generates 7 shift pulses toshift register 400 when the enable signal on the output of OR gate 418is at a logic 1. Inverter 414 inverts the Q_(B) of counter 410 togenerate 8 shift pulses to shift register 422. Because shift register400 is presenting one of the 8 data bits to the input of shift register422 before the generation of any shift pulses, only 7 shift pulses arerequired by register 400 to input all 8 bits to register 422; while 8pulses are required by register 422 to load that data.

When the output of NOR gate 404 removes the clear signal to the binarycounters 410 and 412, they begin to generate output signals each ofwhich is half the frequency of the previous output signal. Thus,selecting three successive outputs would generate 8 possible states,selecting 4 successive outputs would generate 16 possible states, etc.Using this technique, the Q_(B) output of counter 410 generates 8 cyclesfrom the time the enable signal from gate 418 went true until the Q_(B)output of counter 412 goes true. In this manner, the 8 bit data wordthat was strobed into shift register 400 by PORT 3 STROBE* is seriallyclocked into shift register 422. When the Q_(B) output of counter 412goes true at the end of the eighth shift pulse to shift register 422,set-reset flip-flop 402 is set to a logic one. This causes NOR gate 404to once again assert a clear pulse clearing counters 410 and 412 back toa counter of 0. Thus, in the second mode, the above-described sequenceis repeated for sixteen consecutive 8 bit data words.

When shift register 422 contains sixteen 8 bit data words, asserting CMD9* initiates the transfer of the contents of shift register 422 to thememories 214 (see FIGS. 2(a) and 2(b)). With the assertion of CMD 9*,set-reset flip-flop 401 is cleared to a logic zero. This causes NOR gate404 to remove the clear signal to the binary counters 410 and 412. Also,the Q output of flip-flop 401 causes the 8 bit multiplexer 424 to selectthe output from shift register 422 applied to its "B" inputs, as thesource of the data for the memory data lines MD0 through MD7. Inverter426 inverts the select line of multiplexer 424 to generate the controlsignal DTMA MUX that is used by the pin memory address multiplexer 206(see FIG. 2(a)) to enable the data transfer memory address lines DTMA0through DTMA3, generated by counters 410 and 412, to be multiplexed ontothe memory address lines MA0* through MA3*. The signal DTMA MUX is ANDEDwith the Q_(B) output of counter 410 by NAND gate 428 to generate MW* onthe output of inverter gate 432. Thus, a write enable clock is generatedfor each memory address specified by the data transfer addresses DTMA0through DTMA3 to store in the memories 214 the 8 data bits multiplexedonto the memory data lines MD0 through MD7 from shift register 422.

The above sequence continues until sixteen 8 bit data words from shiftregister 422 have been transferred to the pin memories. At thecompletion of the transfer, the Q_(C) of counter 412 goes true causinginterter gate 408 to set flip-flop 401 to a logic 1. This causes NORgate 404 to once again assert a clear signal to the counters 410 and412. Because the Q_(C) output of counter 412 initiates the clear signal,the Q_(B) output of counter 410 will generate 16 cycles before thecounting is stopped. Thus, when Q_(C) goes true and initiates the clearto counter 410 and 414, the sequence of transferring the sixteen 8-bitdata words to the memories 214 is complete.

Referring now to FIG. 2(b), which is a block diagram of pin memory 112and pin drivers 118, the contents of memory 214 used to generate one ofthe Gray code test signals are shown as a sequence of ones and zerosstored in the sixteen memory locations. Shown above each of the bitmemory locations is the pin memory address, in hexa-decimal notation,that will produce on the memory output data and enable lines, D0 and E0,the bit contained in the memory locations shown below the address.

The generation of a digital test signal which are applied to thecontacts of the selectable D switches from data contained in thecontents of memory 214 are the same, and only a discussion of one willbe given. Still referring to FIG. 2(b), the sequence of ones and zerosproduced on the output by the addressing of memory 214 during a testcycle is inputted to the DR0 switch driver 216. The output signal fromthis driver is the digital test signal that drives the DUT via theselectable DR0 switch. The character of the digital test signal that isgenerated from the data stored in memory 214 is controlled by thesequence of addresses with which the memory 214 is addressed. Two memory214 output signals are required to generate a digital test signal, onecalled the data bit; the other the enable bit. The data bit is theoutput signal from memory 214 that is lbeled D0, while the enable bit isthe output labeled E0. As will more fully be discussed below, eachmemory location, from memory address 1 through E, can select a differentwave form from the set of Gray code wave forms to be generated by theDR0 switch driver 216.

Turning now to FIG. 3 and still referring to FIG. 2(b), the test signaltiming diagram is illustrated for various selectable Gray code testsignals, each signal including an initialization and preset portion.There are sixteen addressable memory locations in memory 214. Thecontents of the memory 214 for addresses 0 and F control theinitialization and preset portion of the digital wave form. Theinitialization and preset portion of the digital wave form is generatedat the start of a test cycle. With two of the memory 214 storgelocations used up for the initialization and preset data, only fourteenGray Code test signals can be specified by the remaining memorylocations. This number, of course, can be increased or decreased byincreasing or decreasing the memory capacity of memory 214. It is thedistinguishing characteristic of a Gray code set of wave forms that,when all the waveforms are viewed simultaneously, for any given cycle ofa clocking wave form which generates the digital signals, only onesignal will have a transition from one logic level to the other. Inother words, no more than one transition in all the wave forms thatcomprise the Gray code occur for any given clock cycle. To select one ofthe Gray code test signals, a "1" is recorded in pin memory 214 at theaddress that corresponds to the desired wave form, and zeros arerecorded at the other addresses. Thus, for wave form number 2, a 1 isrecorded in memory location 2; or for wave form number 13, a "1" isrecorded in memory location D.

In addition to the fourteen Gray Code test signals that can be generatedfrom data stored in memories 214, other digital test signals arepossible, such as logic high, logic low, preset high (a single positivepulse at the start of the test cycle), preset low (a single negativepulse at the start of the test cycle) and the many permutations that arepossible in the basic Gray Code signals that are generated by the use ofthe initialization and preset data a long with the enable data recordedin the enable portion of memory 214. An example of just such apermutation is illustrated in FIG. 3 as signal f₂. The following is adiscussion of how the data in memory 214 generates the digital testsignals.

Shown in FIG. 3 is a portion of the sequence of pin memory addressesthat are generated during a test cycle. Also illustrated in FIG. 3 arethe digital test signals that are generated on the output of DR0 switchdriver 216, according to the data on the D0 and E0 output lines of thepin memory 214. A transition in the output digital test signal from DR0switch driver 216 is permitted each time that a 1 is outputted on theD0, line provided that the E0 line has previously or is concurrentlyoutputting a one. Referring to FIG. 3, the four waveforms f₁, f₁ *,preset high f₁, preset low f₁ * are shown. Disregarding theinitialization and preset portion of those waveforms, it can be seenthat on each occurrance of memory address 1, a transition in f₁ occurs.As will be discussed below, the DRIVE ENABLE f₁ signal can modify theillustrated waveforms for f₁ ; but for the f₁ waveforms shown in FIG. 3,DRIVE ENABLE f₁ went true during the initialization portion of the testcycle.

For the initialization and preset time of the test cycle, the sequenceof pin memory addresses is, in sequence, address 0, address F, anaddress designated as "don't care", and once again, address F. Theaddress designated as "don't care" is so labeled because regardless ofwhat address is generated by test signal address generator 202, signalsDSYNC and ESYNC are absent, as nothing is permitted to happen in the DR0switch driver 216 to cause a change in the generated test signal.Illustrated in FIG. 3 for the wave forms f₁ and its derivatives showingthe four possibilities for the initialization and preset portion. Thegeneration of these four wave forms is possible for each of the fourteenGray Code test signal. For the wave forms illustrated, the signal DRIVEENABLE f₁ was asserted at address 0 in the initialization and presetportion of the test cycle by having a "1" recorded in the enable portionof memory 214 at address 0. A different result would have occurred hadthe enable bit been stored in a different memory location. This resultis illustrated for the wave form f₂ in which the enable portion ofmemory 214 has a "1" recorded in location 3 and location 4. The resultof two 1's recorded in the enable portion of the memory 214 is anenabling of the DR0 switch driver 216 on the first occurrence of a "1"on the E0, and a disabling of f₂ on the second occurrence of a "1" onE0.

The illustrated wave form f₂ in FIG. 3 is the signal generated from thedata that is shown as stored in memory 214 in FIG. 2(b). On the firstoccurrence of the memory address 3, DRIVE ENABLE f₂ is asserted and onthe first occurrence of address 4, DRIVE ENABLE f₂ is cleared. Thedotted wave forms that are shown for the signals f₂ and DRIVE ENABLE f₂are the signals that would have been generated had there only been a "1"stored in the enable bit address location 0. As illustrated in FIG. 3, atransition in the DRIVE ENABLE f signals occur on the first occurrenceof a pin memory address with a "1" stored in the enable portion ofmemory 214 for that address rather than on every occurrence of thataddress. This is because the illustrated clocking signal (ESYNC) in FIG.3 which clocks the transitions in the enabling flip-flop 602 (see FIG. 6and the discussion below) has been selected to occur only on the firstoccurrence of a pin memory address. A more detailed discussion of thepossible variations in the generation of the clocking signal ESYNC isgiven in the discussions of the D sync and E sync generator 204.

Still referring to FIG. 3, refer also to FIG. 5 which is the circuitdiagram of the test signal address generator 202 that generates thesequence of pin memory addresses as illustrated in FIG. 3. With theassertion of START CYCLE*, shift register 500 is loaded with a bitpattern that produces on the Q_(A) through Q_(D) outputs, 0101,respectively. For four consecutive cycles of the system clock MCKL*, thesignals INIT*, CLOAD*, and PRESET* are generated. These three wave formsare shown in FIG. 3. The signal CLOAD* loads a fourteen bit binary downcounter 506 with an all 1's pattern. Counter 506 is formed from thecascaded connection of four four bit binary down counters (notillustrated). The output of counter 506 is inputted to the three-bitcascaded priority encoders 508 and 510 along with the signals INIT* andPRESET*. The outputs from encoders 508 and 510 are logically combined inNOR GATES 512, 514, 516 and inverter 518 to generate the Gray codememory address signals GMA0 through GMA3, which are inputted to pinmemory 206 (see FIG. 2(a)). Down counter 506 counts down from an all 1's or maximum count to a count of 0. When counter 506 reaches a count of0, one complete cycle of the Gray code test signals is complete. If morethan one cycle of the Gray code signals are desired, the signal DCLR*from test controller 104 is not asserted, and down counter 506 continuesto count down from a count of 0 to the next count which is once again anall 1's count to begin the next cycle. However, for this and eachsubsequent cycle in the Gray code signals, no initialization or presetaddresses, 0 or F, will occur.

Two clocking signals are generated by the D and E sync generator 204 tobe used by the test signal drivers 118 to generate the digital testsignals on the output of the D switch drivers 216. These two signals arecalled DSYNC* and ESYNC*. FIG. 3 also illustrates these two signals.Except for the address "don't care" in the initilization and presetportion of the sequence of pin memory addresses and on the lastoccurrence of the "F" address in the test cycle, the signal DSYNC* isthe same as the clock signal MCKL*. On the other hand, the signal ESYNC*has the characteristic that it may occur on the first occurrence of eachof the pin memory addresses or may occur on the occurrence of any one orall of the memory addresses.

Referring still to FIG. 5, in which is shown the circuit diagram for theD and E sync generator 204, the signal DSYNC* is derived from MCKL butis enabled only during a test cycle through AND gate 528 and inverter530 by the signal DCLR*. Also, during the initialization and preset timeof the test cycle when the third pin memory address is generated ("don'tcare" address), all input signals to priority encoders 508 and 510 areat a logic one. This causes the PRESET DISABLE output from priorityencoder 510 to be at a logic 0. This level causes DSYNC* to remain highfor that "don't care" pin memory address in the initialization andpreset portion. Because changes in the output of the digital test signalfrom the D switch driver 216 are clocked when the signal DSYNC* goesfalse in the middle of a pin memory address, for the "don't care" pinmemory address of the initialization and preset time, no transition inDSYNC* occurs; thus the label "don't care".

Still referring to FIG. 5, the signal ESYNC* may be selected to occur ononly the first occurrence of each of the pin memory addresses, or it canbe selected to occur on every occurrence of any address or on everyaddress. This flexibility is achieved as follows: A four-bit data wordis inputted to the D sync and E sync generator 204 from the CPU 100 andon the assertion of CMD13*, is strobed into a sixteen-bit latch formedfrom addressable latches 532 and 534. Each of the sixteen latchescorresponds to one address in the possible sixteen pin memory addresses.The output from latches 532 and 534 are inputted to multiplexers 536 and538, respectively. Also inputted to multiplexers 536 and 538 are theGray Code pin memory addresses GMA0 through GMA3. The multiplexed outputfrom multiplexers 536 and 538 are bussed together to form an enablingsignal to one input of AND gate 540. The latches 532 and 534 can beprogrammed to contain all zero's or all one's or any of the combinationsof one's and zero's that are possible. In operation, during the testcycle as the Gray Code pin memory addresses are generated, the contentsof the latch from latches 532 and 534 that corresponds to the generatedaddress is multiplexed to AND gate 540. If a one was stored in thelatch, AND gate 540 is enabled to pass one cycle of MCKL to OR gate 542whose output, acting through inventor 544, generates the signal ESYNC*.If a zero was stored in the latch, AND gate 540 is disabled and noESYNC* signal will be generated. Thus, the signal ESYNC* can beprogrammed to occur on any address by storing a one in the appropriatelatch in latches 532 and 534.

It is also possible to have ESYNC* occur only on the first occurrence ofthe pin memory address during the test cycle. This is accomplished by afour-bit binary counter 522 in association with a four-bit magnitudecomparator 520. At the start of the test cycle, counter 522 is clearedto a count of 0. The binary count from counter 522 is compared to thebinary code on the Gray Code pin memory address lines GMA0 through GMA3,by four-bit magnitude comparator 520. When there is a count match, ANDgate 524 is enabled by the "A=B" output of comparator 520, to permit onecycle of MCKL to be applied as the other input to OR gate 542 and thusto generate the signal ESYNC*. The output from AND gate 524 is invertedby inverter 526 and provides a clock signal to counter 522. Thisincrements counter 522 to the next address. The first occurrence of thisaddress by the pin memory address generator 202 will enable anotherESYNC* to be generated. Once counter 522 has been incremented sixteentimes and reaches a count of 0 there will never be another match inmagnitude comparator 520, because the Gray Code memory address is an all0's or "0" address only during the initialization and present time,which occurs only at the start of the test cycle.

The signals DSYNC* and ESYNC* are inputted to test signal drivers 118 toclock each DR switch driver 216 to generate the digital test signal onthe output of the driver (see FIG. 2(b)). Shown in FIG. 6 is a circuitdiagram of a typical DR switch driver 216. Since all of the DR switchdrivers 216 of test signal drivers 118 are identical in operation, onlya discussion of one will be given. The data (D0) and enable (E0) linesfrom memory 214 for test pin 1 of the bed of nails 122 are inputted to Dswitch driver 216 of FIG. 6 to provide the J and K inputs for flip-flops600 and 602, respectively. Flip-flop 600 is clocked by DSYNC which isthe buffered inverse of DSYNC* (see FIG. 2(b)), while flip-flop 602 isclocked by ESYNC, also buffered. The Q and Q* outputs from flip-flop 600provide inverse digital signals that control the conduction state of acomplimentary pair of field effect transistors Q₁ and Q₂. These twotransistors switch the output signal DR0 between the power supply andground potential for the DUT being tested to provide the voltage swingfor the digital test signal. Ground potential for the DUT is the same asfor the tester.

Before the Q and Q* outputs of flip-flop 600 are allowed to control thetransistors Q₁ and Q₂, the enable flip-flop 602 must be clocked to alogic 1 by ESYNC. Open-collector NAND gate 604 combines the Q output offlip-flop 602 with the Q output of flip-flop 600 to provide the controlsignal for transistor Q₁. Open-collector AND gate 612 combines the Qoutput of flip-flop 602 and the Q* output of flip-flop 600 to providethe control signal for transistor Q₂.

Driver output DR0 has three allowable states: First, when neithertransistor Q1 nor transistor Q2 is conducting, the driver DR0 is said tobe disabled. When the driver is disabled, it does not stimulate thedevice under test. This disabled state is obtained whenever enableflip-flop 602 is cleared to a logic zero. The output of AND gate 612 islow, turning off N-channel-transistor Q2. The output of open-collectorNAND gate 604 is pulled up to "Driver V+" potential by resistor 608,turning off P-channel transistor Q1. In the disabled state, the outputof the driver will be an open circuit. Therefore, it is possible to haveboth the D and the F switch for this test pin selected. During the testcycle, when the driver is disabled, the same node into which a digitaltest signal was or could have been inputted, a response signal couldalso be monitored. For some logic devices, that is the manner in whichthey function. For example, some memory devices require that an addressbe inputted on the same line that the contents of the memory specifiedby that address is outputted on. Because of the disable node ofoperation of the driver 216, the D switches is not required in the setof selectable switches associated with each test pin in the bed of nails122. Second, when transistor Q1 is conducting, the driver output will behigh. This state is obtained whichever enable flip-flop 602 and dataflip-flop 600 are both set. The output of open-collector NAND gate 604is low, stimulating the P-channel transistor Q1. Third, when transistorQ2 is conducting, the driver output will be low. This occurs when enableflip-flop 602 is set and data flip-flop 600 is cleared. The output ofAND gate 612 is high, stimulating the N-channel transistor Q2. Note thatfor either transistor to conduct, the enable flip-flop 602 must be set,and that transistors Q1 and Q2 may not conduct simultaneously. Inaddition, the transistors are able to pass 150 milliamperes, enough todrive a logic node "in-circuit".

Referring now to FIG. 7(a), which illustrates a block diagram of testcontroller 104 and functional tester 106, the command decoder 710 oftest controller 104 is shown connected to one of the CPU 100 I/O 102ports. The function of command decoder 710 is to accept an 8-bit digitalcode from CPU 100 and decode it to generate one of thirty-two systemcommands CMD0* through CMD31*. Command decoder 710 also generates themiscellaneous system commands, such as board address override BAOR*,functional test COUNT*, functional test HIGH*, and EXT CLOCK SELECT*.Shown in Table 1 is a list of the system commands along with itsfunctional name. System commands CMD5* through CMD7* are used to strobedata from the CPU 100 into latches (not shown) that function to generateother signals used by the tester 101 to perform various functions. Thesignals generated by these three system commands, CMD5* through CMD7*,are also shown in Table 1. In particular, this miscellaneous systemcommands mentioned above are generated by CMD7* (mode latch #2) inassociation with the data on the data lines illustrated in Table 1. Thesystem commands that are generated by command decoder 710 are used tostart and stop various functions within the digital tester 101.

                  TABLE 1                                                         ______________________________________                                        COM-                                                                          MAND   SKIP CONTROLLER COMMANDS                                               ______________________________________                                        CMD0*  Master Reset                                                           CMD1*  Trigger An Execution Cycle                                             CMD2*  Reed Set                                                               CMD3*  Reed Clear                                                             CMD4*  Reed Group Clear (RCLR*)                                               CMD5*  Control Reed Latch                                                                              Data Line Control Reeds                                                     0 Response Line Connect                                                       1 Connect E Pole Reed                                                         2 Ground E                                                                    3 Stimuli F                                                                   4 Ground G                                                                    5 not assigned                                         CMD6*  Mode Latch #1     Data Line Mode Latch #1                                                     0 DUT - Reed                                                                  1 DUT + Reed                                                                  2 DUT + 5V Supply Relay                                                       3 DUT + RV Supply Relay                                                       4 not assigned                                                                5 not assigned                                         CMD7*  Mode Latch #2     Data Line Mode Latch #2                                                     0 Count*/High* Reg. Select                                                    1 BAOR*                                                                       2 EXT CLOCK SELECT*                                                           3 not assigned                                                                4 not assigned                                                                5 not assigned                                         CMD8*  Shift Result Registers                                                 CMD9*  Program Data Transfer                                                  CMD10* MG & RA & RG Latch                                                     CMD11* Threshold Voltage Latch                                                CMD12* Clock Division Latch                                                   CMD13* ESYNC Set                                                              CMD14* MEM Write                                                              CMD15* Clear ESYNC Memory                                                     CMD16* Not Assigned                                                           CMD17* Not Assigned                                                           CMD18* PICA Busy Set                                                          CMD19* PICA Busy Reset                                                        CMD20* Interupt Enable                                                        CMD21* Interupt Disable                                                        CMD22*                                                                               ##STR1##                                                              CMD23* X Relay Master Clear (MCLR)                                            CMD24* Not Assigned                                                           CMD25* Not Assigned                                                           CMD26* Not Assigned                                                           CMD27* Not Assigned                                                           CMD28* Not Assigned                                                           CMD29* Not Assigned                                                           CMD30* Not Assigned                                                           CMD31* Not Assigned                                                           ______________________________________                                    

In order to accommodate the various logic voltage levels used bydifferent DUT's, test controller 104, in response to input data from CPU100, generates a negative threshold voltage, (-) THRESHOLD, of a valuesomewhere between the logic low and logic high for that family ofintegrated circuits. This threshold voltage is summed with signals fromthe DUT to generate a voltage that is applied as an input to acomparator. When the DUT signal is equal to a positive thresholdvoltage, the summed voltage will be zero. A more detailed discussion ofthe summing circuits will be given below in the discussion of theresponse line interface 720. The signal (-) THRESHOLD is generated whensystem command CMD18* strobes an 8-bit digital word from the CPU 100into threshold voltage latch 700. The output of latch 700 is inputted todigital-to-analog converter 702, which generates a negative voltagespecified by the binary contents of the threshold latch 700.

The system clock which is generated by and used in the digital tester101 circuits as the master clock is generated by master clock generator706. The system clocks MCKL and MCKL* are outputted by master clockgenerator 706 by dividing down an 8 MHZ oscillator clock signal frominternal oscillator 708 in a divide-by-N counter. The vlaue of N isspecified by the contents of divide-by-N counter latch 704. Systemcommand CMD12* strobes an 8-bit data word (N) from CPU 100 into latch704 to program the divide-by-N counter. Oscillator 708 also provides a 2MHZ oscillator clock signal for use by the pin memory data transfercontroller 200 (see FIG. 4). When an external clock other than the 8 MHZinternal clock is to be used, EXT CLOCK SELECT* is asserted to controlmaster clock generator 706 to select the EXT CLOCK input as the sourceof the clock signal to the divide-by-N counter. Interface circuitbetween the tester 101 and DUT signal levels of the same design that arediscussed below for the response line interface 720 are used tointerface the EXT CLOCK signal into the master clock generator 706.

Still referring to FIG. 7(a), start test cycle generator 714, inassociation with the listen enable generator 712, controls the startingand stopping of the test cycle in which the digital test signals aregenerated and the response line signal monitored by the functionaltester 106. Responding to start test cycle generator 714, listen enablegenerator 712 also generates a listen enable signal LISTEN* that isinputted to the functional tester 106 to allow the functional tester 106to examine the response line signal 128 when the listen enable signal istrue.

FIG. 8 illustrates the circuit diagram for start test cycle generator714 and the listen enable generator 712. Start test cycle generator 714generates the signal START CYCLE* to indicate the beginning of a testcycle. Upon the issuance of the system command CMD1*, flip-flop 800 isclocked by MCKL a logic 1 thus enabling one input of NAND gate 814.Because the Q output of flip-flop 800 was at a logic 0 prior to theissuance of CMD1*, the Q* output of flip-flop 802 is at a logic 1 whenCMD1* is asserted. This signal is inputted to NAND gate 814 as well asthe Q output of flip-flop 800 so that on the occurence of a logic 1 onthe Q output of flip-flop 800, the output of NAND gate 814 asserts STARTCYCLE*. One MCKL cycle later, flip-flop 802 is clocked to a logic zerocausing the output of NAND gate 814 to switch back to a logic one. Thus,START CYCLE* is asserted for one clock cycle of MCKL. Following theassertion of START CYCLE*, DCLR* goes true to indicate that a test cycleis occurring. The Q output of flip-flop 802 is DCLR* which assumes alogic 1 state during a test cycle. A test cycle will continue as long asflip-flop 802 is at a logic one. The three signals START CYCLE*, DCLR*and its inverse DCLR are used throughout the digital tester 101 toenable and disable the various functions that are performed.

The listen enable generator 712, as shown in FIG. 8, determines thelength of the test cycle and generates a listen enable signal LISTEN*that enables the functional tester 106 to monitor and test the responsesignal 128 during a test cycle. LISTEN* will be enabled from the firstoccurrence of a selected pin memory address, although it may notactually be asserted at that time. Further conditions must also occurbefore LISTEN* will be asserted. To better understand the function oflisten enable generator 712, refer to FIG. 10, which illustrates thetiming diagram for five possible digital test signals that are membersof the set of digital test signals. Each transition in the illustratedwaveforms of FIG. 10 occurs when the pin memory address for that testsignal occurs (see FIG. 3). Thus, a transition in f₃ occurs when theaddress "3" occurs. The listen enable generator 712 generates LISTEN*during the time that two preselected test signals are at a logic one andthat a first preselected pin memory address has occurred and that asecond preselected pin memory address has not. In other words, LISTEN*can occur between the first occurrence of two pin memory addresses butwill not be asserted until two other test signals are simultaneously ina logic one state. For example, FIG. 10 illustrates the generation ofLISTEN* that is enabled between address 1 and address 4 with the addedconditions that f₂ and f₃ are at a logic one.

The signal LISTEN* is generated as follows: Listen enable generator 712,as shown in FIG. 8, has a 16×4 bit memory 804 which is similar to thememories 214 in pin memory 112 (see FIG. 2(b)). Inputted to memory 804are the pin memory address signals MA0 through MA3. These addresssignals, as previously discussed, are generated both during the testcycle and also during the initialization of the digital tester 101. Alsoinputted to memory 804 are write enable and data input lines from CPU100. During the initialization of the digital tester 101, data on thedata lines MD4* through MD7* are strobed into memory 804 by assertingbit 7 of port #1 while the pin memories 112 are being programmed. Duringthe test cycle, the contents of memory 804 are outputted to flip-flops806, 808, 810 and 812 under control of the Gray Code pinmemory addressthat are used by memories 214 to generate the digital test signals forthe test pins. The J and F inputs to flip-flops 806, 808 and 810 areconnected to one of the four output bits from memory 804. The J and Kinputs to flip-flop 812 is connected to the output from AND gate 816that has as one of its two inputs, the last of the four bits from memory804. This bit is enabled through AND gate 816 by the signal INITCOMPLETE (see FIG. 5) from the test signal address generator 202. INITCOMPLETE goes true at the end of the initialization and preset portionof the test cycle. The signal INIT COMPLETE is used to prevent theaddresses which occur during the initialization and preset portion ofthe test cycle from terminating the test cycle should those addresses beused in the generation of LISTEN*.

The Q outputs from flip-flop 806 and 808 are inputted to four input ANDgate 826 whose output is the signal LISTEN*. The function of flip-flop806 is to enable one input to AND gate 826 when the first occurrence ofa pin memory address occurs thereby signifying that one of the possibleGray Code signals has gone to a logic one. The function of flip-flop 808is the same as 806. The Q output from set-reset flip-flops 820 and 822are inputted as the two remaining inputs to AND gate 826. Flip-flop 820is set when flip-flop 810 is clocked to a logic one and flip-flop 822 isreset (flip-flop 822 was set at the start of the test cycle by DCLR*) bythe Q output of flip-flop 812 through NAND gate 824 which was enabled bythe Q output of flip-flop 820 after flip-flop 820 has been set. Inoperation, the memory 804 is programmed with logic one's in theappropriate memory locations so that on the occurrence of the pin memoryaddress, during a test cycle, that are selected to start and stop thegeneration of the signal LISTEN* during a logic high of any two GrayCode signals, a logic one will be outputted to flip-flops 806, 808, 810and 812. When flip-flops 806, 808 and 810 have been set, LISTEN* will beasserted. When flip-flop 812 is set, LISTEN* will go false terminatingthe enable signal to the functional tester 106 and the test cycle willbe terminated. The Q output of flip-flop 822, which is reset whenflip-flop 812 is set, is the signal STOP CYCLE which is inputted to thestart test cycle generator 714 to terminate the test cycle.

Now turning to FIG. 7(a), functional tester 106 is shown, composed ofresponse interface 720 responding to the response signal input 128 andthe (-) THRESHOLD voltage to generate the response signal RDATA. Alsoassociated with the output of response line interface 720 is ananalog-to-digital converter 722, for converting the analog response linesignal 128 to an 8 bit digital reresentation. The output ofanalog-to-digital converter 722 is inputted to CPU 100 through one ofthe input ports of I/O ports 102 when the analog voltage of the responseline is desired. Functional tester 106, in addition to theanalog-to-digital converter test, performs three other tests. First, theCRC function tester 724 monitors a bit stream of 1's and 0's on RDATA,to generate a compact digital code representing the length and characterof the bit stream. Second and third the COUNT and HIGH function tester726 counts the number of transistions that occurred in RDATA during thetest cycle for a COUNT test, while the HIGH test counts the number ofsystem clocks MCKL that occur during the logic high periods of theresponse signal RDATA.

Referring now to FIG. 9, which illustrates the circuit diagram of thefunctional tester 106, the response line signal 128 is shown inputted tobuffer amplifier 902 through series resistor 900. The input voltage tobuffer 902 is diode limited between +15 volts and analog ground bydiodes D₁ and D₂. The output of buffer amplifier 902 is inputtedtoresistor 905 and to the analog-to-digital converter 722. The output ofbuffer amplifier 902 is summed with the (-) THRESHOLD voltage generatedby the digital-to-analog converter 702 (see FIG. 7(a)), to form theinput voltage to comparator 906. Resistors 904 and 905, which are bothconnected to the input of comparator 906, comprise the summing networkwhich adds the (-) THRESHOLD voltage to the output of buffer 902. DiodesD₃ and D₄ are connected, in parallel but opposite directions, from theinput of comparator 906 to analog ground. With this configuration, D4limits positive voltages while D3 limits negative voltages. In this way,the input voltage to comparator 906 is limited to voltages of a plus orminus one diode drop about the mid-point of the expected response signalswing of the response line 128. The output of comparator 906 is thesignal RDATA, which is inputted to the CRC 724 and COUNT and HIGH 726function testers.

As shown in FIG. 9, CRC function tester 724 uses a CRCgenerator/checker, such as that manufactured by Fairchild Semiconductormodel 9401, described in their 1976 catalog entitled "micro-logic",which catalog is incorporated herein for all purposes. This devicegenerates a cyclic redundancy check code on the signal RDATA. The systemclock MCKL, when not inhibited by LISTEN*, clocks CRC generator 724through NAND gates 908 and NOR gate 910. At the completion of the testcycle, the contents of the CRC generator 724 are clocked into CPU 100with the assertion of the command CMD8*. Each assertion of CMD8* clocks1 bit of the cyclic redundancy check code into the CPU 100.

As discussed above, the COUNT and HIGH function tester 726 either countsthe number of transitionsin RDATA during the test cycle or counts thenumber of system clocks during the test cycle when RDATA was true. Whenthe functional test COUNT is true, a cascaded connection of BCD counters934, 936, 938 and 940 count the number of positive transitions of theresponse signal RDATA that occurred during the test cycle. The signalCOUNT* is ANDED with the signal RDATA through AND gate 930 to generatethe clock signal for the BCD counters. When the inhibit signal LISTEN*goes false, the BCD counters are allowed to count. In a similar manner,for the functional test HIGH, NAND gate 932 generates a clock signal tothe BCD counters from the system clock MCKL when the signal RDATA istrue.

At the completion of both the COUNT and HIGH functional test, thecontents of the BCD counters are multiplexed onto a single line andinputted to CPU 100. This multiplexing is accomplished by binary counter914 and the one-of-four decoders 916 and 918. The outputs from each ofthe BCD counters are selectively enabled by a select line for eachcounter. The common outputs from each of the counters may be bussedtogether, so that only the output of the BCD counter selected will bepresented to the bus. System command CMD8* is counted by counter 914,which outputs a 4 bit digital code in which the two lower order bits areinputted to one-of-four decoder 916, to generate four enable signals.The two upper bits are inputted to one-of-four encoder 918 to generatefour select signals. The enable signals are inputted to multiplexer NANDgates 920, 922, 924 and 926. The bussed output of each of the BCDcounters is inputted as the other input to each of these multiplexerNAND gates. The outputs of the multiplexer NAND 920, 922, 924 and 926are connected together to form the single output signal COUNT AND HIGHRESULT, which is inputted to the CPU 100 via an input port of I/O ports102. These multiplexing circuits function so that each assertion CMD8*causes each succeeding output from the four cascaded BCD counters 934,936, 938 and 940 to be sequentially multiplexed onto the COUNT AND HIGHRESULT signal line.

When the results from the functional tester 106 have been inputted tothe CPU 100, routines will be executed to compare the measured result toa result that would be expected from a properly functioning DUT. Basedon this comparison, a determination is made as to how the DUT performed.

In describing the invention, reference has been made to a preferredembodiment. However, those skilled in the art and familiar with thedisclosure of the invention may recognize additions, deletions,substitutions or other modifications which would fall within the purviewof the invention as defined in the appended claims.

What is claimed is:
 1. Apparatus for the in-circuit testing of theelectrical properties of components of a circuit, comprising:(a) acentral processing unit for controlling the tests to be performed andfor interpreting the results of said tests; (b) electrical test pins,contactable with electrical nodes in said circuit; (c) sets ofselectable switches, one set associated with each of said test pins, forconnecting each of said test pins to at least one of a plurality ofsignal lines associated with each said pin, said signal lines includinga response signal line; (d) a plurality of digital test-signalgenerators, each of said generators being associated with one of saidtest pins, for generating at least one digital test signal from a set oftest signals, the output line from each of said generators comprisingone of the plurality of signal lines for the test pin associated withsaid generator; (e) switch-selecting means responsive to the centralprocessor, for selecting at least one of said selectable switches, toconnect selected ones of said test pins to their associated plurality ofsignal lines, thereby to connect one of said plurality of digitaltest-signal generators to one of the nodes of the circuit, and toconnect a node of the circuit to the response signal line; (f) a testcontroller responsive to the central processor, for generating a testcycle wherein said digital test-signal generators supply test signals tosaid circuit, thereby to cause the circuit to produce a response signalon said response signal line; and (g) a functional tester responsive tothe central processor, for testing the signal on said response signalline, to determine electrical properties of said circuit.
 2. Theapparatus in accordance with claim 1 wherein said electrical test pinscomprise a bed of nails fixture.
 3. The apparatus of claim 1, whereinthe plurality of selectable switches in each of said sets of selectableswitches includes four selectable switches.
 4. The apparatus of claim 1,wherein said selectable switches are reed switches.
 5. The apparatus ofclaim 1, wherein said set of test signals includes a set of Gray Codetest signals.
 6. The apparatus of claim 5 wherein, the set of Gray codetest signals comprises fourteen digital test signals.
 7. The apparatusof claim 1, wherein each of said digital test-signal generatorsincludes:(a) a memory address generator for generating a sequence ofmemory addresses during said test cycle; (b) a first memory responsiveto said address generator, for outputting a logic signal to select adigital test signal, said memory having a specified storage location foreach digital test signal, said logic signal enabling a transition insaid selected test signal; (c) a second memory responsive to saidaddress generator, for outputting a logic signal to enable and todisable the generation of said selected test signal; (d) asynchronization signal generator responsive to said memory addressgenerator for generating synchronization signals; and (e) a driverresponsive to the output from said first and second memories, and tosaid synchronization signals, for generating the selected digital testsignal and for applying said selected digital test signal to anelectrical node of said circuit.
 8. The apparatus of claim 7, whereinsaid sequence of memory addresses comprises the ordered sequentialaddresses of each of the addressable storage locations of said firstmemory and said second memory, each address in said sequence enabling atransition in said digital test signal specified by that address.
 9. Theapparatus of claim 8, wherein said first memory further comprises amemory location for storing an initialization bit, and another memorylocation for storing a preset bit, said initialization and preset bitsspecifying one of a plurality of possible beginning sequences for eachof said digital test signals.
 10. The apparatus of claim 7, wherein saidsynchronization signal generator includes:(a) means for generating afirst synchronization signal having a transition for each address ofsaid address generator; and (b) means for generating a secondsynchronization signal having a transition,(i) on the first occurrenceof each address in said sequence of memory addresses, or (ii) on eachoccurrence of any or all addresses in said sequence of memory addresses.11. The apparatus of claim 7, wherein said digital test signal generatorfurther comprises means responsive to said processor for addressing andstoring in said first and second memories digital-test-signal-generatingdata prior to the generation of said test cycle.
 12. The apparatus ofclaim 1, wherein said test controller includes:(a) an internaloscillator; (b) a threshold voltage generator responsive to saidprocessor for generating a negative offset voltage to offset thevoltages produced by externally generated signals inputted to thetesting apparatus, the external signals including an external clocksignal; (c) a system clock generator responsive to the external clocksignal, said processor, said oscillator and said threshold voltagegenerator, for generating a system clock, said system clock beingderived from said internal oscillator or from the external clock; (d) acommand decoder responsive to said processor, for generating systemcommands to control the functions of said tester; (e) a listen enablegenerator responsive to said processor and said digital test-signalgenerators, for controlling the length of said test cycle, and forgenerating a listen enable signal to enable said functional tester toperform functional tests on said response signal during the generationof said listen enable signal; and (f) a start test cycle generatorresponsive to said clock, said listen enable generator, and said commanddecoder, for starting and stopping said test cycle.
 13. The apparatus ofclaim 12, wherein said system clock generator includes a divide-by-Ncounter.
 14. The device of claim 12, wherein said threshold voltagegenerator is a digital-to-analog converter.
 15. The apparatus of claim1, wherein said functional tester includes a cyclic redundancy checkfunction tester for generating a digital code representative of thelength and character of the serial digital data stream of said responsesignal, said code representing the signature of said response signal.16. A testing apparatus adapted for use with a computer for thein-circuit testing .Iadd.of components .Iaddend.of a circuit havingelectrical nodes, comprising:(a) a node-connecting means associated witheach of a selected ones of said nodes and responsive to the computer,each selected node having associated therewith signal lines including aresponse signal line, for connecting each of the selected nodes to itsassociated signal lines, one of said selected nodes being connected tothe response signal line; (b) a digital test-signal generator associatedwith each said node-connecting means, for generating at least onedigital test signal from a set of digital test signals, the output linefrom each said generator comprising one of the associated signal linesfor the node associated with said generator; (c) a controller responsiveto the computer, for generating a test cycle in which selected ones ofsaid test signals are applied through said associated node-connectingmeans to selected ones of said selected nodes, said circuit generating asignal on said response signal line in response to said applied testsignals; and (d) a functional tester connected to the response signalline and responsive to the computer, for performing functional tests onsaid response signal to determine electrical properties of said.Iadd.components in the .Iaddend.circuit.
 17. The apparatus of claim 16,wherein each said node-connecting means includes:(a) a test pincontactable with an associated selected electrical node of said circuit;and (b) a set of selectable switches connected to each of said testpins, for connecting each test pin to one of its associated signallines; and (c) switch selecting means responsive to the computer, forselecting at least one of said selectable switches,(i) to connect one ofsaid plurality of digital test-signal generators to one of the nodes ofthe circuit, and (ii) to connect a node of the circuit to the responsesignal line.
 18. The apparatus of claim 17, wherein each said set ofselectable switches includes a switch for connecting the output from oneof said associated digital test-signal generators to its associated testpin.
 19. The apparatus in accordance with claim 16, wherein saidfunctional tester includes:(a) an analog-to-digital converter; (b) acounter for counting(i) the number of cycles in a clock signal thatoccurred when said response test signal is at a logic high state, or(ii) the number of pulses in said response test signal that occur insaid test cycle; and (c) a cyclic redundancy check generator, forgenerating a digital code for the serial bit stream of said responsetest signal, said code representing the signature of said signal. 20.The apparatus of claim 16, wherein said controller includes:(a) a systemclock generator responsive to said computer for generating a mastersystem clock for said tester; (b) a command decoder responsive to saidcomputer for generating control signals to control the functions of saidtester; (c) a listen enable generator responsive to said computer andsaid digital test-signal generators, for generating a listen enablesignal, to enable said functional tester to perform functional tests onsaid response signal during the generation of said listen enable signal,and for controlling the length of said test cycle; and (d) a start testcycle generator responsive to said system clock, said command decoderand said listen enable generator, for starting the stoping said testcycle.
 21. Apparatus adapted for use with a central processor for thein-circuit testing of the electrical properties of .Iadd.components in.Iaddend.a circuit under test, said apparatus having a response signalline for monitoring the response signal from the circuit under test, theapparatus comprising:(a) electrical test pins, contactable withelectrical nodes in said circuit; (b) a selectable switch associatedwith each test pin, for selectively connecting the associated said testpin to the response signal line; (c) a plurality of digital test-signalgenerators, one associated with each of said test pins, for generatingat least one digital test signal from a set of test signals, the outputline from each said generator adapted for connection to its associatedtest pin; (d) switch-selecting means responsive to the centralprocessor, for selecting one said selectable switch to connect a node ofsaid circuit to said response signal line; and (e) a test controllerresponse to the central processor, for generating a test cycle whereinselected ones of said digital test-signal generators supply test signalsto said circuit, thereby to cause the circuit under test to produce aresponse signal on said response signal line.
 22. The apparatus inaccordance with claim 21 further comprising a functional testerconnected to the response signal line and responsive to the centralprocessor, for testing the signal on the response signal line, todetermine electrical properties of the circuit.
 23. The apparatus inaccordance with claim 21 wherein said electrical test pins comprise abed of nails fixture.
 24. The apparatus of claim 21, wherein saidselectable switch is a reed switch.
 25. The apparatus of claim 21,wherein the set of test signals includes a set of Gray Code testsignals.
 26. The apparatus of claim 25, wherein the set of Gray Codetest signals comprises fourteen digital test signals.
 27. The apparatusof claim 21, wherein each of said digital test-signal generatorsincludes:(a) a memory address generator for generating a sequence ofmemory addresses during said test cycle; (b) a first memory responsiveto said address generator, for outputting a logic signal to select adigital test signal, said memory having a specified storage location foreach digital test signal, said logic signal enabling a transition insaid selected test signal; (c) a second memory responsive to saidaddress generator, for outputting a logic signal to enable and todisable the generation of said selected test signal; (d) asynchronization signal generator responsive to said memory addressgenerator for generating synchronization signals; and (e) a driverresponsive to the output from said first and second memories, and tosaid synchronization signals, for generating the selected digital testsignal and for applying said selected digital test signal to anelectrical node of said circuit.
 28. The apparatus of claim 27, whereinsaid sequence of memory addresses comprises the ordered sequentialaddresses of each of the addressable storage locations of said firstmemory and said second memory, each address in said sequence enabling atransition in said digital test signal specified by that address. 29.The apparatus of claim 28, wherein said first memory further comprises amemory location for storing an initialization bit, and another memorylocation for storing a preset bit, said initialization and preset bitsspecifying one of a plurality of possible beginning sequence for each ofsaid digital test signals.
 30. The apparatus of claim 27, wherein saidsynchronization signal generator includes:(a) means for generating afirst synchronization signal having a transition for each address ofsaid address generator; and (b) means for generating a secondsynchronization signal having a transition,(i) on the first occurrenceof each address in said sequence of memory addresses, or (ii) on eachoccurrence of any of all addresses in said sequence of memory addresses.31. The apparatus of claim 27, wherein said digital test signalgenerator futher comprises means responsive to said processor foraddressing and storing in said first and second memoriesdigital-test-signal-generating data prior to the generation of said testcycle.
 32. The apparatus of claim 22, wherein said test controllerincludes:(a) an internal oscillator; (b) a threshold voltage generatorresponsive to said processor for generating a negative offset voltage tooffset the voltages produced by externally generated signals inputted tothe testing apparatus, said external signals including an external clocksignal; (c) a system clock generator responsive to the external clocksignal, said processor, said oscillator and said threshold voltagegenerator, for generating a system clock, said system clock beingderived from said internal oscillator or from the external clock; (d) acommand decoder responsive to said processor, for generating systemcommands to control the functions of said tester; (e) a listen enablegenerator responsive to said processor and said digital test-signalgenerator, for controlling the length of said test cycle, and forgenerating a listen enable signal to enable said functional tester toperform functional tests on said response signal during the generationof said listen enable signal; and (f) a start test cycle generatorresponsive to said listen enable generator, for starting and stoppingsaid test cycle.
 33. The apparatus of claim 32, wherein said systemclock generator includes a divide-by-N counter.
 34. The device of claim32, wherein said threshold voltage generator is a digital-to-analogconverter.
 35. The apparatus in accordance with claim 22, wherein saidfunctional tester includes:(a) an analog-to-digital converter; (b) acounter for counting(i) the number of cycles in a clock signal thatoccurred when said response signal is at a logic high state, or (ii) thenumber of pulses in said response signal that occur in said test cycle;and (c) a cyclic redundancy check generator, for generating a digitalcode from the serial bit stream of said response signal, said coderepresenting the signature of said signal.
 36. An apparatus for use witha central processing unit for in-circuit testing of the electricalproperties of components of a circuit, said apparatus comprising:(a)electrical test pins, contactable with electrical nodes in said circuit;(b) sets of selectable switches, one set associated with each of saidtest pins, for connecting each of said test pins to at least one of aplurality of signal lines associated with each said pin, said signallines including a response signal line; (c) a plurality of digitaltest-signal generators, each of said generators being associated withone of said test pins, for generating at least one digital test signal,the output line from each of said generators comprising one of theplurality of signal lines for the test pin associated with saidgenerator; (d) switch selecting means responsive to the centralprocessor, for selecting at least one of said selectable switches, toconnect selected ones of said test pins to their associated plurality ofsignal lines, thereby (i) to connect one of said plurality of digitaltest-signal generators to one of the nodes of the circuit, and (ii) toconnect a node of the circuit to the response signal line; and (e) atest controller responsive to the central processor, for generating atest cycle wherein said digital test-signal generators supply testsignals to said circuit, thereby to produce a response signal on saidresponse signal line.
 37. The apparatus according to claim 36 furthercomprising a functional tester responsive to the central processor, fortesting the signal on said responsive signal line, to determineelectrical properties of the components of said circuit.
 38. Theapparatus in accordance with claim 36 wherein said electrical test pinscomprise a bed of nails fixture.
 39. The apparatus of claim 36, whereineach of said sets of selectable switches includes four selectableswitches.
 40. The apparatus of claim 36, wherein said selectableswitches are reed switches.
 41. The apparatus of claim 36, wherein saidset of test signals includes a set of Gray Code test signals.
 42. Theapparatus of claim 41 wherein, the set of Gray Code test signalscomprises fourteen digital test signals.
 43. The apparatus of claim 36,wherein each of said digital test-signal generators includes:(a) amemory address generator for generating a sequence of memory addressesduring said test cycle; (b) a first memory responsive to said addressgenerator, for outputting a logic signal to select a digital testsignal, said memory having a specified storage location for each digitaltest signal, said logic signal enabling a transition in said selectedtest signal; (c) a second memory responsive to said address generator,for outputting a logic signal to enable and to disable the generation ofsaid selected test signal; (d) a synchronization signal generatorresponsive to said memory address generator for generatingsynchronization signals; and (e) a driver responsive to the output fromsaid first and second memories, and to said synchronization signals, forgenerating the selected digital test signal and for applying saidselected digital test signal to an electrical node of said circuit. 44.The apparatus of claim 43, wherein said sequence of memory addressescomprises the ordered sequential addresses of each of the addressablestorage locations of said first memory and said second memory, eachaddress in said sequence enabling a transition in said digital testsignal specified by that address.
 45. The apparatus of claim 44, whereinsaid first memory further comprises a memory location for storing aninitialization bit, and another memory location for storing a presetbit, said initialization and preset bits specifying one of a pluralityof possible beginning sequences for each of said digital test signals.46. The apparatus of claim 43, wherein said synchronization signalgenerator includes:(a) means for generating a first synchronizationsignal having a transition for each address of said address generator;and (b) means for generating a second synchronization signal having atransition,(i) on the first occurrence of each address in said sequenceof memory addresses, or (ii) on each occurrence of any or all addressesin said sequence of memory addresses.
 47. The apparatus of claim 43,wherein said digital test signal generator further comprises meansresponsive to said processor for addressing and storing in said firstand second memories digital-test-signal-generating data prior to thegeneration of said test cycle.
 48. The apparatus of claim 37, whereinsaid test controller includes:(a) an internal oscillator; (b) athreshold voltage generator responsive to said processor for generatinga negative offset voltage to offset the voltages produced by externallygenerated signals inputted to the testing apparatus; (c) a system clockgenerator responsive to an external clock signal, said processor, saidoscillator and said threshold voltage generator, for generating a systemclock, said system clock being derived from said internal oscillator orfrom the external clock; (d) a command decoder responsive to saidprocessor, for generating system commands to control the functions ofsaid tester; (e) a listen enable generator responsive to said processorand said digital test-signal generators, for controlling the length ofsaid test cycle, and for generating a listen enable signal to enablesaid functional tester to perform functional tests on said responsesignal during the generator of said listen enable signal; and (f) astart test cycle generator responsive to said system clock, said listenenable generator, and said command decoder, for starting and stoppingsaid test cycle.
 49. The apparatus of claim 48, wherein said systemclock generator includes a divide-by-N counter.
 50. The device of claims48, wherein said threshold voltage generator is a digital-to-analogconverter.
 51. The apparatus of claim 37, wherein said functional testerincludes a cyclic redundancy check function tester for generating adigital code representative of the length and character of the serialdigital data stream of said response signal, said code representing thesignature of said response signal.
 52. An in-circuit testing apparatusadapted for use with a computer for the in-circuit testing of theelectrical properties of components in the circuit, the circuit havingelectrical nodes at which the components are interconnected, theapparatus comprising:(a) means associated with each of selected nodes,and responsive to the computer, for connecting each selected node to oneof a plurality of signal lines associated with each selected node, eachplurality of signal lines including a response signal line; (b) adigital test-signal generator associated with each said means, forgenerating a digital test signal for the circuit under test, the outputline from each said generator comprising one of the associated signallines for the node associated with said generator, said means(i)connecting one of said digital test-signal generators to a selectednode, and (ii) connecting a selected node to the response signal line;and (c) a test controller responsive to the computer, for generating atest cycle in which digital test signals are applied to selected nodes,the circuit generating a signal on the response signal line in responseto the applied test signals.
 53. The apparatus according to claim 52further comprising a functional tester for performing functional testson said response signal to determine electrical properties of thecomponents of the circuit.
 54. The apparatus of claim 52, wherein saidmeans includes:(a) a test pin contactable with an associated selectedelectrical node of the circuit; (b) a set of selectable switchesconnected to each of said test pins, for connecting each test pin to oneof its associated signal lines; and (c) switch selecting meansresponsive to the computer, for selecting said selectable switches. 55.The apparatus of claim 54, wherein each said set of selectable switchesincludes a switch for connecting the output from one of said associateddigital test-signal generators to its associated test pin.
 56. Theapparatus in accordance with claim 53, wherein said functional testerincludes:(a) an analog-to-digital converter; (b) a counter forcounting(i) the number of cycles in a clock signal that occurred whensaid response signal is at a logic high state, or (ii) the number ofpulses in said response signal that occur in said test cycle; and (c) acyclic redundancy check generator, for generating a digital code fromthe serial bit stream of said response signal, said code representingthe signature of said signal.
 57. The apparatus of claim 52, whereinsaid controller includes:(a) a system clock generator responsive to saidcomputer for generating a master system clock for said tester; (b) acommand decoder responsive to said computer for generating controlsignals to control the functions of said tester; (c) a listen enablegenerator responsive to said computer and said digital test-signalgenerators, for generating a listen enable signal, to enable saidfunctional tester to perform functional tests on said response signalduring the generation of said listen enable signal, and for controllingthe length of said test cycle; and (d) a start test cycle generatorresponsive to said system clock, said command decoder and said listenenable generator, for starting and stoping said test cycle.
 58. Theapparatus of claim 54 wherein the set of selectable switches comprises asingle switch which selectively connects its associated test pin to theresponse signal line, the output from each said test-signal generatorbeing removably connected to its associated test pin whereby theassociated test pin connected to the response signal line functionsalternatively(a) as an input stimulus point to the circuit under testduring the entire test cycle, or (b) as an input stimulus point for afirst portion of the test cycle, and as an output response signal pointfor a second portion of the test cycle.
 59. Apparatus adapted for usewith a central processor for the in-circuit testing of the electricalproperties of components of a circuit under test, said apparatus havinga response signal line for monitoring the response signal from thecircuit under test, the apparatus comprising:(a) electrical test pins,contactable with electrical nodes in the circuit; (b) a selectableswitch associated with each test pin, for selectively connecting theassociated said test pin to the response signal line; (c) a plurality ofdigital test-signal generators, one associated with each of said testpins, for generating at least one digital test signal from a set of testsignals, the output line from each said generator adapted for connectionto its associated test pin, each said digital test-signal generatorincluding,(i) a memory address generator for generating a sequence ofmemory addresses during said test cycle, (ii) a first memory responsiveto said address generator, for outputting a logic signal to select adigital test signal, said memory having a specified storage location foreach digital test signal, said logic signal enabling a transition insaid selected test signal, (iii) a second memory responsive to saidaddress generator, for outputting a logic signal to enable and todisable the generation of said selected test signal, (iv) asynchronization signal generator responsive to said memory addressgenerator for generating synchronization signals, and (v) a driverresponsive to the output from said first and second memories, and tosaid synchronization signals, for generating the selected digital testsignal and for applying said selected digital test signal to anelectrical node of said circuit; (d) switch-selecting means responsiveto the central processor, for selecting one said selectable switch toconnect a node of said circuit to said response signal line; (e) a testcontroller responsive to the central processor, for generating a testcycle wherein selected ones of said digital test-signal generatorssupply test signals to said circuit, thereby to cause the circuit undertest to produce a response signal on said response signal line; and (f)a functional tester connected to the response signal line and responsiveto the central processor, for testing the signal on the response signalline, to determine electrical properties of the components of thecircuit, said functional tester including,(i) an analog-to-digitalconverter, (ii) a counter for counting(1) the number of cycles in aclock signal that occurred when said response signal is at a logic highstate, or (2) the number of pulses in said response signal that occur insaid test cycle, and (iii) a cyclic redundancy check generator, forgenerating a digital code from the serial bit stream of said responsesignal, said code representing the signature of said response signal.60. The apparatus of claim 59 wherein said selectable switch selectivelyconnects its associated test pin to the response signal line, the outputfrom each said test-signal generator being removably connected to itsassociated test pin, whereby the associated test pin connected to theresponse signal line functions alternatively(a) as an input stimuluspoint to the circuit under test during the entire test cycle, or (b) asan input stimulus point for a first portion of the test cycle, and as anoutput response point for a second portion of the test cycle. .Iadd. 61.Apparatus adapted for use with a central processor for the in-circuittesting during test cycles of the electrical properties of componentsinterconnected at electrical nodes of a circuit under test, thecomponents being responsive to test signals having first, second anddisconnect logic states, said apparatus having a response signal linefor monitoring a response signal from the circuit under test during atest cycle, the apparatus comprising:(a) a plurality of programmabledigital test-signal generators, each including addressable memorylocations for storing digital signals representative of a test signal tobe applied to the circuit under test,(i) each of said test signalscomprising an independent, selectively variable, uninterrupted sequenceof said first, second and disconnect logic states, (ii) each test signalbeing applied to selected nodes of the circuit under test independentlyof processor control during the test cycle; and (b) a test controlleroperatively coupled to the central processor, for generating a testcycle wherein selected ones of said digital test-signal generatorssupply test signals to said circuit, thereby to cause the circuit undertest to produce a response signal on a response signal line. .Iaddend..Iadd.62. The apparatus in accordance with claim 61 further comprising afunctional tester connected to said response signal line and responsiveto the central processor, for receiving a response signal, to determineelectrical properties of the circuit. .Iaddend. .Iadd.63. The apparatusin accordance with claims 61 or 62 further including electrical testpins contactable with electrical nodes in said circuit, said test pinscomprising a bed-of-nails test fixture. .Iaddend. .Iadd.64. Apparatusadapted for use with a central processor for the in-circuit testingduring test cycles of digital components interconnected at electricalnodes of a circuit under test, the digital components being responsiveto digital test signals having first, second, and disconnect logicstates, said apparatus comprising: (a) a plurality of programmabledigital test-signal means, each including addressable memory locationsfor storing digital signals representative of a test signal to beapplied to the circuit under test during a test cycle,(i) each of saidtest signals comprising an independent, selectively variable,uninterrupted sequence of said first, second and disconnect logicstates, (ii) each test-signal being applied to selected nodes of thecircuit under test independently of processor control during a testcycle; (b) a plurality of test pins, for receiving and applying saidtest signals to nodes of said circuit under test, for providing totalnodal control of the circuit under test; and (c) means operativelycoupled to said processor for receiving a response signal from thecircuit under test in response to said test signals. .Iaddend. .Iadd.65.The apparatus of claim 64 wherein said plurality of test pins comprisesa bed-of-nails test fixture. .Iaddend. .Iadd.66. The apparatus of claims64 or 65 wherein said digital test-signal means includes random accessmemory having addressable memory locations for storing the digitalsignal representative of a test signal to be applied to the circuitunder test. .Iaddend. .Iadd.67. The apparatus of claim 64 wherein saidmeans for receiving said response signal includes means for generating asignature code of the logic states of the response signal. .Iaddend..Iadd.68. Apparatus for the in-circuit testing during test cycles of theelectrical properties of components interconnected at electrical nodesof a circuit under test, the components being responsive to test signalshaving first, second and disconnect logic states, said apparatuscomprising: (a) a central processing unit for specifying the tests to beperformed and for interpreting the results of said tests; (b) abed-of-nails test fixture having a plurality of electrical test pins,contactable with the electrical nodes in said circuit; (c) sets ofselectable switches, one set associated with each of said test pins, forconnecting each of said test pins to at least one of a plurality ofsignal lines associated with each said pin, said signal lines includinga response signal line; (d) a plurality of digital test-signalgenerators, each including random access memory with addressable memorylocations for storing digital signals representative of a test signal tobe applied to the circuit under test during a test cycle and each beingassociated with one of said test pins through one of said plurality ofsignal lines associated with said pin, for generating digital testsignals,(i) each of said test signals comprising an independently,selectively variable, uninterrupted sequence of said first, second anddisconnect logic states, (ii) each test signal being applied to selectednodes of the circuit under test independently of processor controlduring a test cycle; (e) switch-selecting means responsive to thecentral processor, for selecting at least one of said selectableswitches, to connect selected ones of said test pins to their associatedplurality of signal lines, thereby to connect one of said plurality ofdigital test-signal generators to one of the nodes of the circuit, andto connect a node of the circuit to a response signal line; (f) a testcontroller responsive to the central processors, for generating a testcycle wherein said digital test-signal generators supply test signals tosaid circuit, thereby to cause the circuit to produce a response on saidconnected response signal line; and (g) a functional tester responsiveto the central processor, for receiving a response signal, to determineelectrical properties of said circuit. .Iaddend. .Iadd.69. Apparatusadapted for use with a central processor for the in-circuit testingduring test cycles of the electrical properties of componentsinterconnected at electrical nodes of a circuit under test, thecomponents being responsive to test signals having first, second anddisconnect logic states, said apparatus having at least one responsesignal line for monitoring a response signal from the circuit undertest, the apparatus comprising:(a) electrical test pins, contactablewith electrical nodes in said circuit; (b) a selectable switchassociated with each test pin, for selectively connecting the associatedsaid test pin to a response signal line; (c) a plurality of programmabledigital test-signal generators, each operatively coupled to anassociated one of said test pins and each including addressable memorylocations for storing digital signals representative of a test signal tobe applied to the circuit under test during a test cycle,(i) each ofsaid test signals comprising an independent, selectively variable,uninterrupted sequence of said first, second and disconnect logicstates, (ii) each test-signal being applied to selected nodes of thecircuit under test independently of processor control during the testcycle; (d) switch-selecting means responsive to the central processor,for selecting one said selectable switch to connect a node of saidcircuit to a response signal line; and (e) a test controller responsiveto the central processor, for generating a test cycle wherein selectedones of said digital test-signal generators supply test signals to saidcircuit, thereby to cause the circuit under test to produce a responsesignal on said connected signal line. .Iaddend. .Iadd.70. The apparatusin accordance with claim 69 further comprising a functional testerconnected to a response signal line and responsive to the centralprocessor, for receiving a response signal, to determine electricalproperties of the circuit. .Iaddend. .Iadd.71. The apparatus inaccordance with claims 69 or 70 wherein said electrical test pinscomprise a bed-of-nails fixture. .Iaddend. .Iadd.72. An apparatusadapted for use with a central processing unit for in-circuit testingduring test cycles of the electrical properties of componentsinterconnected at electrical nodes of a circuit under test, thecomponents being responsive to test signals having first, second anddisconnect logic states, said apparatus comprising:(a) electrical testpins, contactable with the electrical nodes in said circuit; (b) sets ofselectable switches, one set associated with each of said test pins, forconnecting each of said test pins to at least one of a plurality ofsignal lines associated with each said pin, said signal lines includinga response signal line; (c) a plurality of digital test-signalgenerators, each including addressable memory locations for storingdigital signals representative of a test signal to be applied to thecircuit under test during a test cycle, each said generator beingassociated with one of said test pins where the output from saidassociated generator comprises one of the associated signal lines forthe test pin, for generating at least one digital test signal,(i) eachof said test signals comprising an independent, selectively variable,uninterrupted sequence of said first, second and disconnect logicstates, (ii) each test signal being applied to selected nodes of thecircuit under test independently of processor control during a testcycle, (d) switch-selecting means responsive to the central processor,for selecting at least one of said selectable switches, to connectselected ones of said test pins to their associated plurality of signallines, thereby(i) to connect one of said plurality of digitaltest-signal generators to one of the nodes of the circuit, and (ii) toconnect a node of the circuit to a response signal line; and (e) a testcontroller operatively coupled to the central processor, for generatinga test cycle wherein said digital test-signal generators supply testsignals to said circuit, thereby to produce a response signal on saidconnected response signal line. .Iaddend. .Iadd.73. The apparatusaccording to claim 72 further comprising a functional tester responsiveto the central processor, for receiving a response signal, to determineelectrical properties of the components of said circuit. .Iaddend..Iadd. . The apparatus in accordance with claim 72 or 73 wherein saidelectrical test pins comprise a bed-of-nails fixture. .Iaddend..Iadd.75. Apparatus adapted for use with a central processor for thein-circuit testing of the electrical properties of componentsinterconnected at electrical nodes of a circuit under test, thecomponents being responsive to test signals having first, second, anddisconnect logic states, the apparatus comprising:(a) a plurality ofprogrammable digital test-signal generators, each including addressablememory locations for storing digital signals indicative of a test signalto be applied to the circuit under test,(i) each said addressable memorylocation, when addressed, outputting a multi-bit digital code having afirst part indicative of the first or second logic state for the testsignal and a second part indicative of the disconnect logic state, (ii)each test signal being applied to selected nodes of the circuit undertest independently of processor control; and (b) a test controllerresponsive to the central processor, for controlling selected ones ofsaid digital test-signal generators during a test of a component tosupply test signals to said circuit, thereby to cause the circuit undertest to produce a response signal. .Iaddend. .Iadd.76. The apparatus ofclaim 75 wherein said second part of said digital code controls theoutputting of the indicated first or second logic state to the circuitunder test, said apparatus further including a flip-flop responsive tosaid first part of said digital code for generating the indicated firstor second logic state for the test signal, said first part of saiddigital code capable of indicating that(i) the logic state of the testsignal shall remain the same as before; or (ii) the logic state of thetest signal shall toggle to the opposite state. .Iaddend. .Iadd.77. Theapparatus of claim 76 wherein said flip-flop is a J-K flip-flop..Iaddend. .Iadd.78. The apparatus of claim 76 further including a cyclicredundancy check register coupled to said response signal forcompressing the actual response data from the circuit under test..Iaddend. .Iadd.79. The apparatus in accordance with claims 75 or 76further including electrical test pins contactable with electrical nodesin said circuit, said test pins comprising a bed-of-nails test fixture..Iaddend. .Iadd.80. Apparatus adapted for use with a central processorfor the in-circuit testing of digital components interconnected atelectrical nodes of a circuit under test, the digital components beingresponsive to digital test signals having first, second, and disconnectlogic states, said apparatus comprising:(a) a plurality of programmabledigital test-signal means, each including addressable memory locationsfor storing digital signals representative of a test signal to beapplied to the circuit under test,(i) each of said test signalscomprising an independent, selectively variable, uninterrupted sequenceof said first, second, and disconnect logic states, (ii) eachtest-signal being applied to selected nodes of the circuit under testindependently of processor control, (iii) each said addressable memorylocation, when addressed, outputting a multi-bit digital code having afirst part indicative of the first or second logic state for the testsignal and a second part indicative of the disconnect logic state, saidsecond part controlling the outputting of the indicated first or secondlogic state of the test signal to the circuit under test; (b) aplurality of test pins, for receiving and applying said test signals tonodes of said circuit under test, for providing total nodal control ofthe circuit under test; and (c) means for receiving a response signalfrom the circuit under test in response to said test signals. .Iaddend..Iadd.81. The apparatus of claim 80 wherein said means for receiving aresponse signal includes a cyclic redundancy check generator forcompressing the digital response data bits from the circuit under test..Iaddend. .Iadd.82. The apparatus of claim 80 wherein each said digitaltest-signal means includes:(a) random access memory having saidaddressable memory locations for storing said digital code; and (b) aflip-flop responsive to said first part of said digital code forgenerating the indicated first or second logic state for the testsignal, said first part of said digital code capable of controllig saidflip-flop to keep the same logic state as before or to toggle thedigital test signal to the opposite logic state. .Iaddend.